Integrity is built through consistent actions. Lam has been recognized by Ethisphere as one of the World’s Most Ethical Companies for the fourth consecutive year.
Not every chip on a wafer behaves the same, and even small variations can impact yield. Our latest Semiverse Solutions article breaks down how engineers use virtual fabrication to understand why these differences happen and how to fix them. We take a clear look at how data, modeling, and smarter process choices are improving device performance across the entire wafer!
Explore how silicon photonics, replacing copper interconnects with light-based data transmission, will drive the next wave of AI advancement.
Packaging complexity changes the requirements for dielectric deposition. Ming Li, vice president of strategic projects (dielectrics) in our Deposition Product Group, joins Silicon Semiconductor to walk through the thinking behind VECTOR®️ TEOS 3D. Learn more in the full video.
"Top Supplier for 2025" has a nice ring to it! Honored to be recognized by Micron for our commitment to high-quality performance and innovation. Read more.
“When we invest in students’ potential, we strengthen the innovation pipeline that drives our company and our industry to enable breakthroughs that advance the world.” — Christie Valdez, Senior Director of Global Social Impact. Read the blog post to learn more.
Molybdenum (Mo) hybrid metallization cuts via/line resistance by ~55% and reduces stress-induced voids, improving BEOL reliability. Using virtual fabrication and simulation, we mapped the optimal Mo via profiles to maximize performance without costly wafer experiments. Get the full rundown via the blog.
Ultra-thick dielectric films are essential for today’s 3D chip architectures, but they come with challenges like cracks, voids, wafer bowing, and throughput limits. Our deposition tool VECTOR® TEOS 3D solves these challenges with precision deposition technology built for advanced packaging. Learn how via our blog.
How do you scale 3D NAND to 1,000 layers while reducing environmental impact? Lam Cryo™ 3.0 uses cryogenic etch technology to create ultra-precise memory channels that deliver higher storage density, improved efficiency, and lower energy use for the AI era. Read more via Engineeringness.
Why molybdenum? Corporate VP & GM Dr. Kaihan Ashtiani joins Semiconductor Insiders to discuss the material and process innovations shaping next-gen devices. Listen now.
