I applied for the role of a Design Engineer in February. Got a phone screen end of Feb with the recruiter. After that, had a phone interview with the hiring manager, 1st week of March. Last week of March, I went onsite for my interview. I interviewed with 10 people separately. Met the whole team at Boise. The questions were varied. Mostly from digital and analog electronics. Some memory based questions on DRAMs and Flash. Lots of personality based questions and some puzzles. Although the interview was very long, it was very interesting. The team was very pleasant to interact with and the interview felt conversational. I also spent a lot of time talking about my research in grad school. I recommend going over your resume properly and be prepared for lots of digital and analog questions.

First HR phone screen. Then hiring manager phone screen reviewing resume and some technical questions, then panel interview with other engineers. Process varies between teams but most engineering positions will require a panel interview.