J'ai postulé via un établissement d'enseignement supérieur ou universitaire. Le processus a pris 2 jours. J'ai passé un entretien chez KLA (Trichy) en avr. 2019
Entretien
On campus interview based on a workshop on a open book coding challenge followed by coding and mcq round which includes data structure , c/c++, networking etc. The coding round was based on 2d array and string
J'ai postulé en ligne. J'ai passé un entretien chez KLA (Singapour) en avr. 2026
Entretien
HR started a friendly call and email interview set-up with the hiring team in a week. But from there, everything went downhill. HR asked for my past payslips in the beginning and I wasn't even interviewed yet. It was the first redflag. Then, HR gets quiet after receiving my expected salary. The interview itself was the worst. The interviewer was distracted, kept thinking and mumbling about her meetings. She was not a true software engineer because she couldn't accept that there can be multiple solutions to a problem.
Questions d'entretien [1]
Question 1
Example code review and application development concepts
J'ai postulé via une agence de recrutement. J'ai passé un entretien chez KLA (Migdal Ha`Emeq) en janv. 2026
Entretien
The interview was a group interview, I was interviewed twice. The first interview was easy with two problems that I had to solve. The second interview was with a team manager, half in English.
Questions d'entretien [1]
Question 1
Write a function in C that accepts a byte and returns how many ones there are in one byte.
J'ai postulé via un établissement d'enseignement supérieur ou universitaire. J'ai passé un entretien chez KLA (Coimbatore) en déc. 2025
Entretien
We had a hackathon for two days in which iterative shortlistings was done to select the people. Before this, a basic coding round where 2 questions were asked. Those who were shortlisted went into the hackathon process. Two rounds of hackathon spanned over 2 days happened and the results were announced at the end of day 2.
Questions d'entretien [1]
Question 1
They asked a hackathon question that involved wafers and dies - based on semiconductor industry.