J'ai postulé via un établissement d'enseignement supérieur ou universitaire. Le processus a pris 5 jours. J'ai passé un entretien chez HP Inc. (Noida) en janv. 2023
Entretien
The interview process was structured and well-organized. It included an initial screening followed by technical interviews focusing on problem-solving and coding skills. The interviewers were friendly and provided clear feedback throughout. Overall, it was a positive experience.
Questions d'entretien [1]
Question 1
They asked me to explain my approach to solving a complex algorithm problem.
1 round with code test and project details. All process is onsite.
Code test is from leetcode hot 100 and other basic C language questions.
Generally it is quite easy and smooth
J'ai postulé via un établissement d'enseignement supérieur ou universitaire. Le processus a pris 5 semaines. J'ai passé un entretien chez HP Inc. (Gorakhpur, Uttar Pradesh) en nov. 2023
Entretien
The first round is basically an assessment round in which they ask some coding & some question of aptitude. I have cleared the first round. The second round is Technical round in which they asked some question of core subject (OS,DBMS,OOPS) & some DSA question. I have cleared the second round. The Third round is Managerial Round in which they asked some question of puzzle & i am unable to solve that puzzle. I am unable to clear the third round.
J'ai postulé via un établissement d'enseignement supérieur ou universitaire. Le processus a pris 1 jour. J'ai passé un entretien chez HP Inc. (Bengaluru) en sept. 2023
Entretien
Medium level DSA questions- linked list, arrays, strings, stacks, queues, differences
Networking -Osi layers, ipv4, ipv6, protocols of all layers
Cloud computing -AWS
Operating system- virtual memory utilization, CPU scheduling algorithms, threading, semaphores, deadlock
